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Influence of Ambient Temperature on Radiative and Convective Heat Dissipation Ratio in Polymer Heat Sinks

Miniaturization of electronic devices leads to new heat dissipation challenges and traditional cooling methods need to be replaced by new better ones. Polymer heat sinks may, thanks to their unique properties, replace standardly used heat sink materials in certain applications, especially in applica...

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Publicat a:Polymers (Basel)
Autors principals: Kominek, Jan, Zachar, Martin, Guzej, Michal, Bartuli, Erik, Kotrbacek, Petr
Format: Artigo
Idioma:Inglês
Publicat: MDPI 2021
Matèries:
Accés en línia:https://ncbi.nlm.nih.gov/pmc/articles/PMC8309214/
https://ncbi.nlm.nih.gov/pubmed/34301043
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/polym13142286
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