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Orthogonal Experimental Research on Dielectrophoresis Polishing (DEPP) of Silicon Wafer
Silicon wafer with high surface quality is widely used as substrate materials in the fields of micromachines and microelectronics, so a high-efficiency and high-quality polishing method is urgently needed to meet its large demand. In this paper, a dielectrophoresis polishing (DEPP) method was propos...
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| Veröffentlicht in: | Micromachines (Basel) |
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| Hauptverfasser: | , , , , , |
| Format: | Artigo |
| Sprache: | Inglês |
| Veröffentlicht: |
MDPI
2020
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| Schlagworte: | |
| Online Zugang: | https://ncbi.nlm.nih.gov/pmc/articles/PMC7345328/ https://ncbi.nlm.nih.gov/pubmed/32471163 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi11060544 |
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