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Thermal Conductivity Characterization of Thermal Grease Containing Copper Nanopowder
As electronic devices and mainboards become smaller, the need for thermal conductive materials having excellent internal heat dissipation is increasing. In this study, nano thermal grease was prepared by mixing in copper nanopowder, which is used as a heat transfer medium in thermal grease, which is...
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| Publié dans: | Materials (Basel) |
|---|---|
| Auteurs principaux: | , , , , , , |
| Format: | Artigo |
| Langue: | Inglês |
| Publié: |
MDPI
2020
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| Sujets: | |
| Accès en ligne: | https://ncbi.nlm.nih.gov/pmc/articles/PMC7215347/ https://ncbi.nlm.nih.gov/pubmed/32316526 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/ma13081893 |
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