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Laser-based Thickness Control in a Double-Side Polishing System for Silicon Wafers
Thickness control is a critical process of automated polishing of large and thin Si wafers in the semiconductor industry. In this paper, an elaborate double-side polishing (DSP) system is demonstrated, which has a polishing unit with feedback control of wafer thickness based on the scan data of a la...
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| Publicado no: | Sensors (Basel) |
|---|---|
| Main Authors: | , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
MDPI
2020
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC7147602/ https://ncbi.nlm.nih.gov/pubmed/32183097 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/s20061603 |
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