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Kinetic Modelling of Electroless Nickel–Phosphorus Plating under High Pressure
[Image: see text] In electroless nickel–phosphorus plating (ENPP), growth of the plated layer under high pressure was found to be faster than under ambient pressure. To quantitatively elucidate the effect of high pressure on the mechanism of the ENPP reaction, we propose a kinetic model that takes i...
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| Veröffentlicht in: | ACS Omega |
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| Hauptverfasser: | , , , , , , |
| Format: | Artigo |
| Sprache: | Inglês |
| Veröffentlicht: |
American Chemical Society
2020
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| Online Zugang: | https://ncbi.nlm.nih.gov/pmc/articles/PMC7114698/ https://ncbi.nlm.nih.gov/pubmed/32258930 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1021/acsomega.0c00312 |
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