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Universal three-dimensional crosslinker for all-photopatterned electronics
All-solution processing of large-area organic electronics requires multiple steps of patterning and stacking of various device components. Here, we report the fabrication of highly integrated arrays of polymer thin-film transistors and logic gates entirely through a series of solution processes. The...
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| Publicado no: | Nat Commun |
|---|---|
| Main Authors: | , , , , , , , , , , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Nature Publishing Group UK
2020
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC7089981/ https://ncbi.nlm.nih.gov/pubmed/32251285 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1038/s41467-020-15181-4 |
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