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Cutting-based single atomic layer removal mechanism of monocrystalline copper: edge radius effect
The ultimate objective of mechanical cutting is to down minimum chip thickness to single atomic layer. In this study, the cutting-based single atomic layer removal mechanism on monocrystalline copper is investigated by a series of molecular dynamics analysis. The research findings report that when c...
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| Publié dans: | Nanoscale Res Lett |
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| Auteurs principaux: | , |
| Format: | Artigo |
| Langue: | Inglês |
| Publié: |
Springer US
2019
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| Sujets: | |
| Accès en ligne: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6898710/ https://ncbi.nlm.nih.gov/pubmed/31811570 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1186/s11671-019-3195-4 |
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