Mu, F., Xu, Y., Shin, S., Wang, Y., Xu, H., Shang, H., . . . Chen, D. (2019). Wafer Bonding of SiC-AlN at Room Temperature for All-SiC Capacitive Pressure Sensor. Micromachines (Basel).
استشهاد بنمط شيكاغوMu, Fengwen, et al. "Wafer Bonding of SiC-AlN At Room Temperature for All-SiC Capacitive Pressure Sensor." Micromachines (Basel) 2019.
MLA استشهادMu, Fengwen, et al. "Wafer Bonding of SiC-AlN At Room Temperature for All-SiC Capacitive Pressure Sensor." Micromachines (Basel) 2019.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.