Highly Plasmonic Titanium Nitride by Room-Temperature Sputtering

Titanium nitride (TiN) has recently emerged as an attractive alternative material for plasmonics. However, the typical high-temperature deposition of plasmonic TiN using either sputtering or atomic layer deposition has greatly limited its potential applications and prevented its integration into exi...

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Publicat a:Sci Rep
Autors principals: Chang, Chun-Chieh, Nogan, John, Yang, Zu-Po, Kort-Kamp, Wilton J. M., Ross, Willard, Luk, Ting S., Dalvit, Diego A. R., Azad, Abul K., Chen, Hou-Tong
Format: Artigo
Idioma:Inglês
Publicat: Nature Publishing Group UK 2019
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Article
Accés en línia:https://ncbi.nlm.nih.gov/pmc/articles/PMC6814862/
https://ncbi.nlm.nih.gov/pubmed/31653881
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1038/s41598-019-51236-3
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