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Highly Plasmonic Titanium Nitride by Room-Temperature Sputtering
Titanium nitride (TiN) has recently emerged as an attractive alternative material for plasmonics. However, the typical high-temperature deposition of plasmonic TiN using either sputtering or atomic layer deposition has greatly limited its potential applications and prevented its integration into exi...
Gorde:
| Argitaratua izan da: | Sci Rep |
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| Egile Nagusiak: | , , , , , , , , |
| Formatua: | Artigo |
| Hizkuntza: | Inglês |
| Argitaratua: |
Nature Publishing Group UK
2019
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| Gaiak: | |
| Sarrera elektronikoa: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6814862/ https://ncbi.nlm.nih.gov/pubmed/31653881 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1038/s41598-019-51236-3 |
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