Wird geladen...
Fabrication of Simultaneously Implementing “Wired Face-Up and Face-Down Ultrathin Piezoresistive Si Chips” on a Film Substrate by Screen-Offset Printing
We realized the implementation of an ultrathin piezoresistive Si chip and stretchable printed wires on a flexible film substrate using simple screen-offset printing technology. This process does not require a special MEMS fabrication equipment and is applicable to face-up chips where electrodes are...
Gespeichert in:
| Veröffentlicht in: | Micromachines (Basel) |
|---|---|
| Hauptverfasser: | , , , , , |
| Format: | Artigo |
| Sprache: | Inglês |
| Veröffentlicht: |
MDPI
2019
|
| Schlagworte: | |
| Online Zugang: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6780128/ https://ncbi.nlm.nih.gov/pubmed/31454906 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi10090563 |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|