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Sintering Copper Nanoparticles with Photonic Additive for Printed Conductive Patterns by Intense Pulsed Light

In this study, an ink formulation was developed to prepare conductive copper thin films with compact structure by using intense pulsed light (IPL) sintering. To improve inter-particle connections in the sintering process, a cuprous oxide shell was synthesized over copper nanoparticles (CuNP). This c...

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Detalhes bibliográficos
Publicado no:Nanomaterials (Basel)
Main Authors: Chung, Wan-Yu, Lai, Yi-Chin, Yonezawa, Tetsu, Liao, Ying-Chih
Formato: Artigo
Idioma:Inglês
Publicado em: MDPI 2019
Assuntos:
Acesso em linha:https://ncbi.nlm.nih.gov/pmc/articles/PMC6723544/
https://ncbi.nlm.nih.gov/pubmed/31349711
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/nano9081071
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