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One-Step Fabrication of Copper Nanopillar Array-Filled AAO Films by Pulse Electrodeposition for Anisotropic Thermal Conductive Interconnectors
[Image: see text] By using pulse electrodeposition, a copper nanopillar array (CuNPA) was filled into porous anodized aluminum oxide (AAO) films to achieve a highly thermal conductive interconnector with anisotropic property. After 120 min pulse deposition, CuNPA uniformly filled the pores of AAO wi...
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| Publicado no: | ACS Omega |
|---|---|
| Main Authors: | , , , , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
American Chemical Society
2019
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| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6648779/ https://ncbi.nlm.nih.gov/pubmed/31459756 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1021/acsomega.8b03533 |
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