A carregar...
Highly stacked 3D organic integrated circuits with via-hole-less multilevel metal interconnects
Multilevel metal interconnects are crucial for the development of large-scale organic integrated circuits. In particular, three-dimensional integrated circuits require a large number of vertical interconnects between layers. Here, we present a novel multilevel metal interconnect scheme that involves...
Na minha lista:
| Publicado no: | Nat Commun |
|---|---|
| Main Authors: | , , , , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Nature Publishing Group UK
2019
|
| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6546689/ https://ncbi.nlm.nih.gov/pubmed/31160606 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1038/s41467-019-10412-9 |
| Tags: |
Adicionar Tag
Sem tags, seja o primeiro a adicionar uma tag!
|