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Impact of Solvent Evaporation and Curing Protocol on Degree of Conversion of Etch-and-Rinse and Multimode Adhesives Systems
OBJECTIVES: This study evaluated the effect of air-drying time and light-curing time on the degree of conversion (DC) of three etch-and-rinse adhesive systems: ONE-STEP (OS) and ONE-STEP plus (OSP), Ambar (AMB), and two multimode adhesive systems: All-Bond Universal (ABU) and ScotchBond Universal (S...
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| Publicado no: | Int J Dent |
|---|---|
| Main Authors: | , , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Hindawi
2019
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6487092/ https://ncbi.nlm.nih.gov/pubmed/31097965 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1155/2019/5496784 |
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