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Impact of Solvent Evaporation and Curing Protocol on Degree of Conversion of Etch-and-Rinse and Multimode Adhesives Systems

OBJECTIVES: This study evaluated the effect of air-drying time and light-curing time on the degree of conversion (DC) of three etch-and-rinse adhesive systems: ONE-STEP (OS) and ONE-STEP plus (OSP), Ambar (AMB), and two multimode adhesive systems: All-Bond Universal (ABU) and ScotchBond Universal (S...

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Detalhes bibliográficos
Publicado no:Int J Dent
Main Authors: Carvalho, Ceci Nunes, Lanza, Marcos Daniel Septímio, Dourado, Letícia Gomes, Carvalho, Edilausson Moreno, Bauer, José
Formato: Artigo
Idioma:Inglês
Publicado em: Hindawi 2019
Assuntos:
Acesso em linha:https://ncbi.nlm.nih.gov/pmc/articles/PMC6487092/
https://ncbi.nlm.nih.gov/pubmed/31097965
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1155/2019/5496784
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