Caricamento...

Molecular Dynamics Simulation on the Effect of Bonding Pressure on Thermal Bonding of Polymer Microfluidic Chip

Thermal bonding technology is the most commonly used approach in bonding injection-molded microfluidic chips. Although the bonding mechanism is still under debate, the molecular dynamics (MD) method can provide insight into the bonding process on a macromolecular level. In this study, MD simulations...

Descrizione completa

Salvato in:
Dettagli Bibliografici
Pubblicato in:Polymers (Basel)
Autori principali: Zhou, Mingyong, Xiong, Xiang, Drummer, Dietmar, Jiang, Bingyan
Natura: Artigo
Lingua:Inglês
Pubblicazione: MDPI 2019
Soggetti:
Accesso online:https://ncbi.nlm.nih.gov/pmc/articles/PMC6473845/
https://ncbi.nlm.nih.gov/pubmed/30960541
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/polym11030557
Tags: Aggiungi Tag
Nessun Tag, puoi essere il primo ad aggiungerne! !