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Effects of High-Temperature Storage on the Elasticity Modulus of an Epoxy Molding Compound
Changes in the elasticity modulus of an epoxy molding compound (EMC), an electronic packaging polymer, under high-temperature air storage conditions, are discussed in this study. The elasticity modulus of EMC had two different compositions (different filling contents) under different temperatures (1...
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| Publicado no: | Materials (Basel) |
|---|---|
| Main Authors: | , , , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
MDPI
2019
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6416563/ https://ncbi.nlm.nih.gov/pubmed/30823605 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/ma12040684 |
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