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Enhancement of Heat Dissipation by Laser Micro Structuring for LED Module
Optimization for heat dissipation plays a significant role in energy saving and high-efficiency utilizing of integrated electronics. In this paper, we present a study of micro structuring on polymer-based flexible substrate coupled with aluminum-alloy heat sink. The heat dissipation performance was...
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| Publicado no: | Polymers (Basel) |
|---|---|
| Main Authors: | , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
MDPI
2018
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6403799/ https://ncbi.nlm.nih.gov/pubmed/30960811 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/polym10080886 |
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