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Aluminum Patterned Electroplating from AlCl(3)–[EMIm]Cl Ionic Liquid towards Microsystems Application †
Electroplating process is being used to deposit a relatively thick film of metallic materials for various microsystems applications, such as for the wafer-level bonding sealing frame and as a thermal actuator. Recently, the Al electroplating process from ionic liquid has been an attractive depositio...
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| Опубликовано в: : | Micromachines (Basel) |
|---|---|
| Главные авторы: | , , , |
| Формат: | Artigo |
| Язык: | Inglês |
| Опубликовано: |
MDPI
2018
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| Предметы: | |
| Online-ссылка: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6266407/ https://ncbi.nlm.nih.gov/pubmed/30424571 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi9110589 |
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