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Pd-Free Activation Pretreatment for Electroless Ni-P Plating on NiFe(2)O(4) Particles
A Pd-free activation pretreatment process was developed for electroless Ni-P plating on NiFe(2)O(4) particles. The main influencing factors, including NiCl(2)·6H(2)O concentration, pH of electroless bath and temperature, were investigated. Microstructures of the coating layers were characterized by...
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| Pubblicato in: | Materials (Basel) |
|---|---|
| Autori principali: | , , , , , |
| Natura: | Artigo |
| Lingua: | Inglês |
| Pubblicazione: |
MDPI
2018
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| Soggetti: | |
| Accesso online: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6213431/ https://ncbi.nlm.nih.gov/pubmed/30249993 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/ma11101810 |
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