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Acoustic Patterning for 3D Embedded Electrically Conductive Wire in Stereolithography
In this paper, we reported a new approach for particle assembly with acoustic tweezer during three-dimensional (3D) printing for the fabrication of embedded conductive wire with 3D structures. A hexagon shaped acoustic tweezer was incorporated with Digital Light Processing (DLP) based stereolithogra...
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| Опубликовано в: : | J Micromech Microeng |
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| Главные авторы: | , , , , |
| Формат: | Artigo |
| Язык: | Inglês |
| Опубликовано: |
2017
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| Предметы: | |
| Online-ссылка: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6195324/ https://ncbi.nlm.nih.gov/pubmed/30344375 |
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