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Fabrication and Characterization of Capacitive Micromachined Ultrasonic Transducers with Low-Temperature Wafer Direct Bonding
This paper presents a fabrication method of capacitive micromachined ultrasonic transducers (CMUTs) by wafer direct bonding, which utilizes both the wet chemical and O(2) plasma activation processes to decrease the bonding temperature to 400 °C. Two key surface properties, the contact angle and surf...
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| Publicado en: | Micromachines (Basel) |
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| Autores principales: | , , |
| Formato: | Artigo |
| Lenguaje: | Inglês |
| Publicado: |
MDPI
2016
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| Materias: | |
| Acceso en línea: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6189800/ https://ncbi.nlm.nih.gov/pubmed/30404398 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi7120226 |
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