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Technology for 3D System Integration for Flexible Wireless Biomedical Applications
This paper presents a new 3D bottom-up packing technology for integrating a chip, an induction coil, and interconnections for flexible wireless biomedical applications. Parylene was used as a flexible substrate for the bottom-up embedding of the chip, insulation layer, interconnection, and inductors...
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| Publicado no: | Micromachines (Basel) |
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| Main Authors: | , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
MDPI
2018
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6187830/ https://ncbi.nlm.nih.gov/pubmed/30424146 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi9050213 |
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