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Thermal conductivity in Bi(0.5)Sb(1.5)Te(3+x) and the role of dense dislocation arrays at grain boundaries

Several prominent mechanisms for reduction in thermal conductivity have been shown in recent years to improve the figure of merit for thermoelectric materials. Such a mechanism is a hierarchical all-length-scale architecturing that recognizes the role of all microstructure elements, from atomic to n...

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Detalhes bibliográficos
Publicado no:Sci Adv
Main Authors: Deng, Rigui, Su, Xianli, Zheng, Zheng, Liu, Wei, Yan, Yonggao, Zhang, Qingjie, Dravid, Vinayak P., Uher, Ctirad, Kanatzidis, Mercouri G., Tang, Xinfeng
Formato: Artigo
Idioma:Inglês
Publicado em: American Association for the Advancement of Science 2018
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Acesso em linha:https://ncbi.nlm.nih.gov/pmc/articles/PMC5983911/
https://ncbi.nlm.nih.gov/pubmed/29868641
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1126/sciadv.aar5606
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