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Thermal conductivity in Bi(0.5)Sb(1.5)Te(3+x) and the role of dense dislocation arrays at grain boundaries
Several prominent mechanisms for reduction in thermal conductivity have been shown in recent years to improve the figure of merit for thermoelectric materials. Such a mechanism is a hierarchical all-length-scale architecturing that recognizes the role of all microstructure elements, from atomic to n...
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| Publicado no: | Sci Adv |
|---|---|
| Main Authors: | , , , , , , , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
American Association for the Advancement of Science
2018
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC5983911/ https://ncbi.nlm.nih.gov/pubmed/29868641 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1126/sciadv.aar5606 |
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