Citazione APA

Sunday, C. E., Veksler, D., Cheung, K. C., & Obeng, Y. S. (2017). Microwave evaluation of electromigration susceptibility in advanced interconnects. J Appl Phys.

Stile di citazione Chicago

Sunday, Christopher E., Dmitry Veksler, Kin C. Cheung, e Yaw S. Obeng. "Microwave Evaluation of Electromigration Susceptibility in Advanced Interconnects." J Appl Phys 2017.

Citazione MLA

Sunday, Christopher E., Dmitry Veksler, Kin C. Cheung, e Yaw S. Obeng. "Microwave Evaluation of Electromigration Susceptibility in Advanced Interconnects." J Appl Phys 2017.

Attenzione: Queste citazioni potrebbero non essere precise al 100%.