Carregant...

Investigation of Interfacial Layer for Ultrasonic Spot Welded Aluminum to Copper Joints

The bonding formation for ultrasonic welding of dissimilar metals has been shrouded in mystery because of the complex thermomechanical behavior at the bonding interface. We investigated the microstructure and phases at the bonding interface of ultrasonically welded aluminum to copper joints using tr...

Descripció completa

Guardat en:
Dades bibliogràfiques
Publicat a:Sci Rep
Autors principals: Zhang, Zijiao, Wang, Kaifeng, Li, Jingjing, Yu, Qian, Cai, Wayne
Format: Artigo
Idioma:Inglês
Publicat: Nature Publishing Group UK 2017
Matèries:
Accés en línia:https://ncbi.nlm.nih.gov/pmc/articles/PMC5624868/
https://ncbi.nlm.nih.gov/pubmed/28970498
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1038/s41598-017-12164-2
Etiquetes: Afegir etiqueta
Sense etiquetes, Sigues el primer a etiquetar aquest registre!