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Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components
The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a sold...
Shranjeno v:
| izdano v: | Materials (Basel) |
|---|---|
| Main Authors: | , , , , |
| Format: | Artigo |
| Jezik: | Inglês |
| Izdano: |
MDPI
2014
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| Teme: | |
| Online dostop: | https://ncbi.nlm.nih.gov/pmc/articles/PMC5456432/ https://ncbi.nlm.nih.gov/pubmed/28788270 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/ma7127706 |
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