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Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)
3D integration with through-silicon via (TSV) is a promising candidate to perform system-level integration with smaller package size, higher interconnection density, and better performance. TSV fabrication is the key technology to permit communications between various strata of the 3D integration sy...
שמור ב:
| הוצא לאור ב: | Nanoscale Res Lett |
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| Main Authors: | , |
| פורמט: | Artigo |
| שפה: | Inglês |
| יצא לאור: |
Springer US
2017
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| נושאים: | |
| גישה מקוונת: | https://ncbi.nlm.nih.gov/pmc/articles/PMC5247381/ https://ncbi.nlm.nih.gov/pubmed/28105605 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1186/s11671-017-1831-4 |
| תגים: |
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