Lattice Boltzmann Method of Different BGA Orientations on I-Type Dispensing Method

This paper studies the three dimensional (3D) simulation of fluid flows through the ball grid array (BGA) to replicate the real underfill encapsulation process. The effect of different solder bump arrangements of BGA on the flow front, pressure and velocity of the fluid is investigated. The flow fro...

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Bibliographic Details
Published in:PLoS One
Main Authors: Abas, Aizat, Gan, Z. L., Ishak, M. H. H., Abdullah, M. Z., Khor, Soon Fuat
Format: Artigo
Language:Inglês
Published: Public Library of Science 2016
Subjects:
Research Article
Online Access:https://ncbi.nlm.nih.gov/pmc/articles/PMC4959703/
https://ncbi.nlm.nih.gov/pubmed/27454872
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1371/journal.pone.0159357
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