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Characteristics and Mechanism of Cu Films Fabricated at Room Temperature by Aerosol Deposition

We were successful in growing a dense Cu film on Al(2)O(3) substrates at room temperature using an aerosol deposition (AD) method. The characteristics of Cu films were investigated through electrical resistivity and X-ray photoelectron spectroscopy (XPS). The resistivity of Cu films was low (9.2–12....

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Bibliographische Detailangaben
Veröffentlicht in:Nanoscale Res Lett
Hauptverfasser: Lee, Dong-Won, Kwon, Oh-Yun, Cho, Won-Ju, Song, Jun-Kwang, Kim, Yong-Nam
Format: Artigo
Sprache:Inglês
Veröffentlicht: Springer US 2016
Schlagworte:
Online Zugang:https://ncbi.nlm.nih.gov/pmc/articles/PMC4805680/
https://ncbi.nlm.nih.gov/pubmed/27009529
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1186/s11671-016-1378-9
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