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A novel approach of chemical mechanical polishing using environment-friendly slurry for mercury cadmium telluride semiconductors
A novel approach of chemical mechanical polishing (CMP) is developed for mercury cadmium telluride (HgCdTe or MCT) semiconductors. Firstly, fixed-abrasive lapping is used to machine the MCT wafers, and the lapping solution is deionized water. Secondly, the MCT wafers are polished using the developed...
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| Publicado no: | Sci Rep |
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| Main Authors: | , , , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Nature Publishing Group
2016
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC4772544/ https://ncbi.nlm.nih.gov/pubmed/26926622 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1038/srep22466 |
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