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Dielectric Spectroscopic Detection of Early Failures in 3-D Integrated Circuits
The commercial introduction of three dimensional integrated circuits (3D-ICs) has been hindered by reliability challenges, such as stress related failures, resistivity changes, and unexplained early failures. In this paper, we discuss a new RF-based metrology, based on dielectric spectroscopy, for d...
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| Publicado no: | ECS Trans |
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| Main Authors: | , , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
2015
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC4671275/ https://ncbi.nlm.nih.gov/pubmed/26664695 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1149/06906.0079ecst |
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