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Three-Dimensional Porous Copper-Graphene Heterostructures with Durability and High Heat Dissipation Performance

Porous materials have historically been of interest for a wide range of applications in thermal management, for example, in heat exchangers and thermal barriers. Rapid progress in electronic and optoelectronic technology necessitates more efficient spreading and dissipation of the heat generated in...

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Detalhes bibliográficos
Publicado no:Sci Rep
Main Authors: Rho, Hokyun, Lee, Seungmin, Bae, Sukang, Kim, Tae-Wook, Su Lee, Dong, Jung Lee, Hyun, Yeon Hwang, Jun, Jeong, Tak, Kim, Sungmin, Ha, Jun-Seok, Hyun Lee, Sang
Formato: Artigo
Idioma:Inglês
Publicado em: Nature Publishing Group 2015
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Acesso em linha:https://ncbi.nlm.nih.gov/pmc/articles/PMC4522598/
https://ncbi.nlm.nih.gov/pubmed/26234425
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1038/srep12710
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