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Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate
The downsizing of solder balls results in larger interfacial intermetallic compound (IMC) grains and less Cu substrate consumption in lead-free soldering on Cu substrates. This size effect on the interfacial reaction is experimentally demonstrated and theoretically analyzed using Sn-3.0Ag-0.5Cu and...
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| Publicado no: | Sci Rep |
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| Main Authors: | , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Nature Publishing Group
2014
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC4236743/ https://ncbi.nlm.nih.gov/pubmed/25408359 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1038/srep07117 |
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