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Packaging and Non-Hermetic Encapsulation Technology for Flip Chip on Implantable MEMS Devices
We report here a successful demonstration of a flip-chip packaging approach for a microelectromechanical systems (MEMS) device with in-plane movable microelectrodes implanted in a rodent brain. The flip-chip processes were carried out using a custom-made apparatus that was capable of the following:...
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| Main Authors: | , , , , , , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
2012
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC3888989/ https://ncbi.nlm.nih.gov/pubmed/24431925 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1109/JMEMS.2012.2190712 |
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