A carregar...
A flexible nanobrush pad for the chemical mechanical planarization of Cu/ultra-low-к materials
A new idea of polishing pad called flexible nanobrush pad (FNP) has been proposed for the low down pressure chemical mechanical planarization (CMP) process of Cu/ultra-low-к materials. The FNP was designed with a surface layer of flexible brush-like nanofibers which can ‘actively’ carry nanoscale ab...
Na minha lista:
| Main Authors: | , , , |
|---|---|
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Springer
2012
|
| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC3499454/ https://ncbi.nlm.nih.gov/pubmed/23110959 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1186/1556-276X-7-603 |
| Tags: |
Adicionar Tag
Sem tags, seja o primeiro a adicionar uma tag!
|