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Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices
This paper discusses the assembly challenges considering the design and manufacturability of a Wafer Level Thin Film Package in MEMS applications. The assembly processes are discussed. The loads associated with these processes are illustrated and evaluated. Numerical calculations are combined with e...
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| Autori principali: | , , |
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| Natura: | Artigo |
| Lingua: | Inglês |
| Pubblicazione: |
Molecular Diversity Preservation International (MDPI)
2010
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| Soggetti: | |
| Accesso online: | https://ncbi.nlm.nih.gov/pmc/articles/PMC3274256/ https://ncbi.nlm.nih.gov/pubmed/22319337 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/s100403989 |
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