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Characterization of the mechanical and thermal interface of copper films on carbon substrates modified by boron based interlayers
The manipulation of mechanical and thermal interfaces is essential for the design of modern composites. Amongst these are copper carbon composites which can exhibit excellent heat conductivities if the Cu/C interface is affected by a suitable interlayer to minimize the Thermal Contact Resistance (TC...
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| Main Authors: | , , , , , , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Elsevier Sequoia
2011
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC3252241/ https://ncbi.nlm.nih.gov/pubmed/22241938 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1016/j.surfcoat.2011.01.039 |
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