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Passive and Chipless Packaged Sensor for the Wireless Pressure Monitoring in Harsh Environment

A new millimetre-wave passive and chipless packaged sensor for wireless pressure monitoring in harsh environment is proposed. This sensor uses a planar microstrip resonator coupled with a high resistivity silicon membrane. The remote interrogation of this sensor is performed from a Frequency-Modulat...

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Detalhes bibliográficos
Main Authors: Julien Philippe, Cristina Arenas, Dominique Henry, Anthony Coustou, Alexandre Rumeau, Hervé Aubert, Patrick Pons
Formato: Artigo
Idioma:Inglês
Publicado em: MDPI AG 2017-08-01
Colecção:Proceedings
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Acesso em linha:https://www.mdpi.com/2504-3900/1/4/629
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