Studies on Curing Kinetics and Tensile Properties of Silica-Filled Phenolic Amine/Epoxy Resin Nanocomposite

In this study, the curing kinetics of the phenolic amine/epoxy resin system were investigated by nonisothermal differential scanning calorimetry (DSC). The model-free isoconversional method of Ozawa&#8211;Flynn&#8211;Wall reveals a dependence of <i>E</i><sub>&#945;</...

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Main Authors: Ting Zheng, Xiaodong Wang, Chunrui Lu, Xiaohong Zhang, Yi Ji, Chengying Bai, Yiwen Chen, Yingjie Qiao
Formato: Artigo
Idioma:Inglês
Publicado em: MDPI AG 2019-04-01
Colecção:Polymers
Assuntos:
cure kinetics
tensile strength
epoxy resin
nanocomposite
Acesso em linha:https://www.mdpi.com/2073-4360/11/4/680
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