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Electrochemical deposition of tin-copper alloy coatings
Solderable tin-base alloy coatings are widely used when assembling electronic products. The reorientation of production to lead-free technologies sets the task of developing new technological processes for the formation of coatings for electrical contacts with stable electrical properties, high sold...
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Main Authors: | , , , , |
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Formato: | Artigo |
Idioma: | Russo |
Publicado em: |
Educational institution «Belarusian State University of Informatics and Radioelectronics»
2021-11-01
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Colecção: | Doklady Belorusskogo gosudarstvennogo universiteta informatiki i radioèlektroniki |
Assuntos: | |
Acesso em linha: | https://doklady.bsuir.by/jour/article/view/3207 |
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