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Seismic behavior of soil–pile–structure interaction with a modified Desai thin-layer interface element

The Desai thin-layer interface element is widely utilized in the simulation of interaction between piles and soil under seismic load. Conventional seismic analysis using the interface element cannot simulate the process of energy dissipation because tangential damping is disregarded. In this study,...

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Библиографические подробности
Главные авторы: Yu Miao, Erlei Yao, Hui Luo, Hongping Zhu
Формат: Artigo
Язык:Inglês
Опубликовано: SAGE Publishing 2016-12-01
Серии:Advances in Mechanical Engineering
Online-ссылка:https://doi.org/10.1177/1687814016680940
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