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Seismic behavior of soil–pile–structure interaction with a modified Desai thin-layer interface element

The Desai thin-layer interface element is widely utilized in the simulation of interaction between piles and soil under seismic load. Conventional seismic analysis using the interface element cannot simulate the process of energy dissipation because tangential damping is disregarded. In this study,...

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Detalhes bibliográficos
Main Authors: Yu Miao, Erlei Yao, Hui Luo, Hongping Zhu
Formato: Artigo
Idioma:Inglês
Publicado em: SAGE Publishing 2016-12-01
Colecção:Advances in Mechanical Engineering
Acesso em linha:https://doi.org/10.1177/1687814016680940
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