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Seismic behavior of soil–pile–structure interaction with a modified Desai thin-layer interface element

The Desai thin-layer interface element is widely utilized in the simulation of interaction between piles and soil under seismic load. Conventional seismic analysis using the interface element cannot simulate the process of energy dissipation because tangential damping is disregarded. In this study,...

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Bibliografiske detaljer
Main Authors: Yu Miao, Erlei Yao, Hui Luo, Hongping Zhu
Format: Artigo
Sprog:Inglês
Udgivet: SAGE Publishing 2016-12-01
Serier:Advances in Mechanical Engineering
Online adgang:https://doi.org/10.1177/1687814016680940
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