Nano-mechanical Behaviour and Microstructural Evolution of Cu/Si Thin Films at Different Annealing Temperatures

This study investigates the nano-mechanical properties of as deposited Cu/Si thin films indented to a depth of 2000 nm using a nanoindentation technique. Cu films with a thickness of 1800 nm are deposited on (100) silicon substrates and the indented specimens are then annealed at temperatures of 160...

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Hauptverfasser: Woei-Shyan Lee, Tao-Hsing Chen, Chi-Feng Lin, Yu-Liang Chuang
Format: Artigo
Sprache:Inglês
Veröffentlicht: Taiwan Association of Engineering and Technology Innovation 2012-07-01
Schriftenreihe:International Journal of Engineering and Technology Innovation
Schlagworte:
Nanoindentation
Silicon
Microstructural evolution
Annealing temperature
Online Zugang:http://ojs.imeti.org/index.php/IJETI/article/view/82
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