Efficacy of Transistor Interleaving in DICE Flip-Flops at a 22 nm FD SOI Technology Node

Fully Depleted Silicon on Insulator (FD SOI) technology nodes provide better resistance to single event upsets than comparable bulk technologies, but upsets are still likely to occur at nano-scale feature sizes, and additional hardening techniques should be explored. Three flip-flop designs were imp...

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Principais autores: Christopher J. Elash, Zongru Li, Chen Jin, Li Chen, Jiesi Xing, Zhiwu Yang, Shuting Shi
Formato: Artigo
Idioma:Inglês
Publicado em: MDPI AG 2022-04-01
coleção:Applied Sciences
Assuntos:
Dual Interlocked Cell (DICE)
flip-flop
radiation
single event upset
single event effects
soft errors
Acesso em linha:https://www.mdpi.com/2076-3417/12/9/4229
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