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Fabrication of Micro-Punch Array by Plasma Printing for Micro-Embossing into Copper Substrates
Copper substrates were wrought to have micro-grooves for packaging by micro-stamping with use of a AISI316 stainless steel micro-punch array. The micro-texture of this arrayed punch was first tailored and compiled into CAD data. A screen film was prepared to have the tailored micro-pattern in corres...
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| Main Authors: | , , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
MDPI AG
2019-08-01
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| Colecção: | Materials |
| Assuntos: | |
| Acesso em linha: | https://www.mdpi.com/1996-1944/12/16/2640 |
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