載入...
A Photolithography Process Design for 5 nm Logic Process Flow
With the introduction of EUV lithography, the photolithographic process in 5 nm logic process can be simplified to use mostly single exposure method. In a typical 5 nm logic process, the contact-poly pitch (CPP) is 44-50 nm, the minimum metal pitch (MPP) is around 30-32 nm. And the overlay budget is...
Na minha lista:
| Main Authors: | , , , |
|---|---|
| 格式: | Artigo |
| 語言: | Inglês |
| 出版: |
JommPublish
2019-12-01
|
| 叢編: | Journal of Microelectronic Manufacturing |
| 主題: | |
| 在線閱讀: | http://www.jommpublish.org/p/41/# |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|