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Influence of Channel Orientation in Air Coolers on the Efficiency of Heat Removal from Powerful Semiconductor Devices

The results of the study of air-cooled coolers with natural and forced heat removal from such powerful semiconductor devices as processors are presented. Experiments were performed in the SOLIDWORKS Flow Simulation software environment to assess the influence of the orientation of the formed thermal...

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Detaylı Bibliyografya
Asıl Yazarlar: G. A. Piskun, V. F. Alexeev, A. N. Belikov, D. G. Rybakov
Materyal Türü: Artigo
Dil:Russo
Baskı/Yayın Bilgisi: Educational institution «Belarusian State University of Informatics and Radioelectronics» 2023-10-01
Seri Bilgileri:Доклады Белорусского государственного университета информатики и радиоэлектроники
Konular:
Online Erişim:https://doklady.bsuir.by/jour/article/view/3721
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