Low Conductivity Decay of Sn–0.7Cu–0.2Zn Photovoltaic Ribbons for Solar Cell Application
The present study applied Sn−0.7Cu−0.2Zn alloy solders to a photovoltaic ribbon. Intermetallic compounds of Cu<sub>6</sub>Sn<sub>5</sub> and Ag<sub>3</sub>Sn formed at the Cu/solder/Ag interfaces of the module after reflow. Electron probe microanalyzer images showed that a Cu−Zn so...
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| Главные авторы: | , , , |
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| Формат: | Artigo |
| Язык: | Inglês |
| Опубликовано: |
MDPI AG
2019-08-01
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| Серии: | Micromachines |
| Предметы: | |
| Online-ссылка: | https://www.mdpi.com/2072-666X/10/8/550 |
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