Research progress on preparation methods, interface modification, and first-principles calculation of diamond/copper composites
Diamond/copper composites have the excellent thermal conductivity and the controllable thermal expansion coefficient, making them expected to become new generation of thermal management materials. However, the wettability between diamond and copper is poor, and the interface bonding of the prepared...
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| Autors principals: | , , , , , , |
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| Format: | Artigo |
| Idioma: | Chinês |
| Publicat: |
Editorial Office of Powder Metallurgy Technology
2026-02-01
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| Col·lecció: | Fenmo yejin jishu |
| Matèries: | |
| Accés en línia: | https://pmt.ustb.edu.cn/article/doi/10.19591/j.cnki.cn11-1974/tf.2024110004 |
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